Description
Leveraging the low power consumption and advanced performance of the 1.2GHz VIA Nano® X2 E-Series processor and VIA VX11H MSP including the integrated VIA C-640 graphics processor with DX11 support for richer textures and 3D stereoscopic display, the VIA AMOS-3003 combines a rugged design with rich network connectivity including dual Gigabit Ethernet (GLAN), and optional Wi-Fi, GPS, and 3G networking.
Packing List:
AMOS-3003 system, Screw pack: (4 × M4*8mm screws with spring & flat washer for wall mounting, 6 × M2*5mm screws for mini card & mSATA module, 4 × M3*5mm screws for SSD/HDD, 2-pole phoenix plug to DC-In, Thermal pad for SSD/HDD, Thermal pad for mSATA module, Thermal grease (0.5cc syringe)
